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Although the application of microcapsules in adhesives has been started since the 1970s, its application so far has been limited to a few fields such as fastening and pressure-sensitive adhesives, and there are not many other applications. The difficulty of the process, the increase of the cost, and the effect of some wall materials on the adhesive properties of the adhesive may be the reasons for restricting the application. However, research in various countries is very active and new research patents emerge every year. In the new century, the application of microcapsules in adhesives may be mainly carried out in the following aspects:
Development of Controlled Release Adhesive Products Using Microcapsule Controlled Release
The controlled release of the microcapsules used in adhesives generally seldom utilizes the sustained release effect of the porous vesicle wall, but rather the substances that originally separated from each other are contacted and reacted by destroying the tight wall of the capsule. Controlled release methods include temperature control, pressure control, and chemical solvent control (such as water). They are suitable for the rapid reaction of adhesives and curing agents at room temperature, the purpose of which is to facilitate storage, transportation and application. The adhesive material can be wrapped, and the curing agent can also be wrapped. The actual situation should be selected. Can be widely used in epoxy adhesives, polyurethane adhesives and other fields that require the use of curing agents or cross-linking agents.
The use of microcapsules to modify the surface properties of the encased material has led to the development of water-based adhesives.
For ease of coating, most of the adhesives use solvents. The use of large amounts of organic solvents pollutes the environment, endangers health, and easily causes fire. The emulsification method can make part of the adhesive into a water-based product. However, the emulsification method cannot be used for some binders that easily react with water (such as monoisocyanate prepolymers) and curing agents (such as boron trifluoride). The adhesive or curing agent or adhesive is integrally formed into microcapsules, and the affinity of the wall material for water can be dispersed in water. This method can in principle be applied to all non-polar binders for the preparation of water-based adhesives, although some varieties are simpler to emulsify.
Using the encapsulation of the microcapsules, an adhesive that is easy to store, transport, and use is prepared.
At present, the application of microcapsules in adhesives is mainly in this respect, and this application will be further developed. Solid-state microcapsule adhesives, microcapsules for fastening and sealing applications, and microcapsule adhesives for special applications such as water are constantly being developed. In addition, some special functional materials such as conductive, magnetically permeable materials and adhesives are mixed and then micro-packed, or these functional materials are micro-packed and mixed in adhesives, and the production of adhesives with special functions is also a development direction.
Application of microcapsules in adhesives
Microcapsules are capsular substances formed by enveloping a certain material core in a microcontainer having a diameter of 1 to 1000 μm. The material to be wrapped can be a solid, a liquid or a gas, a hydrophilic substance, or a hydrophobic substance. Most of the encapsulating materials that form the capsule wall are natural, semi-synthetic, or synthetic polymer materials, and also small organic solid molecules such as paraffin wax, grease, and beeswax, and inorganic materials such as calcium sulfate, silicates, and metals and glass. The use of microcapsules in adhesives began with the production of microcapsule anaerobic adhesives by Loc-tite in the 1970s. Later gradually extended to the sealant, conductive adhesive, plastic and other fields. It has become a key technology for preparing pre-coated, controlled curing adhesives and improved adhesive formulations. The application of microcapsules in adhesives is generally in three ways: micropackaging of adhesives, micropackaging of curing agents, and micropackaging of adhesives as a whole.